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ICES675-NCB

COMe 为工业相关应用提供可靠的嵌入式平台,是客制化的理想选择,同时可减少项目进度和成本

Main Features
  • 8th Generation Intel® Core™ Processors, BGA 1440, PCH CM246
  • 2 channel DDR4 with ECC or non-ECC SO-DIMM 2666MHZ up to 32GB
  • Support triple display VGA, 2 x DP , eDP/LVDS 24bit dual channel.
  • PCI Express Lane x16 (configurable: “1 x16” ; “2 x8” ; “1 x8 + 2 x4”)
  • PCI Express Lane x1 (Gen 3), 8x (can be configured x1, x4)
  • IO: 2 x UART(RX/TX), 8 Bit DIO, WDT, TPM(Optional)

Overview

The ICES675 Serial is a COM Express Type 6-pinouts Basic module which featuring Intel ® C240 series PCH chipset supports Intel ® 8th and Intel® Xeon® and Intel ® Core™ processors 2 channel DDR4 with ECC or non-ECC SO-DIMM 2666MHZ up to 32GB. The ICES675 integrated Intel ® HD Graphics engines support or expands via PCI Express Graphic 1 x 16 lanes and support three DDI (Digital Display Interface) to follow the standard of PICMG COM2.0 specification. It allows type 6-pinout Carrier board to implement DDI and legacy VGA interface.
With the 125 x 95mm Type 6 COM Express modules, the boards are offered with numerous processor variants: Intel® Xeon® E-2176M Processor(Support ECC), and Intel® Core™ i5-8400H Processor(non-ECC).
The high performance ICES675 COM Express Basic Module supports 1 x GBE LAN, 4 x USB3.1 GEN1, 8 x USB2.0, 4 x SATA3.0, 2 x UART(TX/RX), HD Audio, 8 bit DIO, TPM (Optional)  ICEB 8060 as well as customized solution for your embedded projects.

Specifications

CPU / Chipset
  • 8th Generation Intel® Core™ Processors, BGA 1440
    Intel® Xeon® E-2176M Processor, 6 Cores, 12M Cache, 2.7GHz (4.4GHz), 45W (Support ECC)
    Intel® Core™ i7-8850H Processor, 6 Cores, 12M Cache, 2.6GHz (4.3GHz), 45W
    Intel® Core™ i5-8400H Processor, 4 Cores, 8M Cache, 2.5GHz (4.2GHz), 45W
  • Intel® Mobile CM246

Main Memory
  • Dual channel DDR4 SO-DIMM memory Socket with non-ECC support, up to 32 GB 2666MHZ, ECC support as option with Intel® Xeon® E-2176M Processor .

BIOS
  • AMI (UEFI)

Display

COM Express Connector
  • AB :LVDS:(LVDS/eDP co-lay), VGA:(VGA/DDI port3 co-lay), 1 x GbE LAN, 6x PCIe x1, HD Audio, 4 x SATA III, 8 x USB2.0, LPC Bus, SM Bus/I2C, 2 x COM, GPIO 8bit
  • CD : DDI1, DDI2, 1 x PCIe x16, 2 x PCIe x1, 4 x USB3.0

Power Requirement
  • +12VDC, +5Vsb
  • Support both AT and ATX power supply mode

Dimensions
  • 125mm x 95mm

Environment
  • Board level operation temperture : -0°C to 60°C
  • Storage temperture : -20˚C to 85˚C
  • Relative humidty:
    10% to 95% (operating, non-condensing)
    5% to 95% (non-operating, non-condensing)

Certifications
  • Meet CE / FCC Class B

Ordering Information

Barebone
  • ICES675-2176-HCA (P/N: TBD)
On-board Intel® 8th Intel® Xeon® E-2176M Processorr, 2 x DDR4 SO-DIMM(Support ECC), Support multiple display from VGA/LVDSD/DDI1/2, 4 x SATAIII, 1x GbE LAN, 2 x COM, 4x USB3.0, 8 x USB2.0, HD Audio, 8bit GPIO.

  • ICES675-8400-HCA (P/N: TBD)
On-board Intel® 8th Intel® Core™ i5-8400H Processor, 2 x DDR4 SO-DIMM(Non-ECC), Support multiple display from VGA/LVDSD/DDI1/2, 4 x SATAIII, 1x GbE LAN, 2 x COM, 4x USB3.0, 8 x USB2.0, HD Audio, 8bit GPIO 


Optional Accessories
  • CPU Cooler (P/N:TBD)
  • Heat spreader (P/N:79K0067401X00)
  • TPM 2.0 Module KIT (P/N:79E00TPM01X00)

Download

驅動程序
上传日期 文件名 版本 OS 描述 下载
2020/03/05 ICES675 Chipset 1.0 All OS ICES675 Chipset 4.6 MB
2020/03/05 ICES675 Graphics 1.0 All OS ICES675 Graphics 245.9 MB
2020/03/05 ICES675 ME 1.0 All OS ICES675 ME 102.1 MB
2020/03/05 ICES675 Ethernet 1.0 All OS ICES675 Ethernet 69 MB
2020/03/05 ICES675 Audio 1.0 All OS ICES675 Audio 110.1 MB