NexCOBOT Taiwan
13F, No.916, Zhongzheng Rd., Zhonghe Dist., New Taipei City, Taiwan 23586, R.O.C.
TEL: +886-2-8226-7786


COMe provides a reliable embedded platform for industrial applications, which is ideal for customization, while reducing project progress and costs

  • 8/9th Generation Intel® Core™ Processors, socket 1511 , PCH C246
  • 2 channel DDR4 with ECC or non-ECC SO-DIMM 2666MHZ up to 32GB
  • Support triple display VGA, 2 x DP , eDP/LVDS 24bit dual channel
  • PCI Express Lane x16 (configurable: “1 x16” ; “2 x8” ; “1 x8 + 2 x4”)
  • PCI Express Lane x1 (Gen 3), 8x (can be configured x1, x4)
  • IO: 2 x UART(RX/TX), 8 Bit DIO, WDT, TPM(Optional)


The ICES675S Series is a COM Express Type 6-pinouts Basic module which featuring Intel® C240 series PCH chipset supports Intel® 8/9th Generation Intel® Core™ Processors, socket 1511 ,DDR4 with ECC or non-ECC SO-DIMM 2666MHZ up to 32GB. The ICES675S-NCB integrated Intel® HD Graphics engines support or expands via PCI Express Graphic 1 x 16 lanes and support three DDI (Digital Display Interface) to follow the standard of PICMG COM2.0 specification. It allows type 6-pinout Carrier board to implement DDI and legacy VGA interface.

The high performance ICES675 COM Express Basic Module supports 1 x GBE LAN, 4 x USB3.1 GEN1, 8 x USB2.0, 4 x SATA3.0, 2 x UART(TX/RX), HD Audio, 8 bit DIO, TPM (Optional) ICEB 8060 as well as customized solution for your embedded projects.


CPU / Chipset

  • 8/9th Intel® (Coffee Lake-S) Core™ i9/ i7/ i5 /i3 Processor, LGA1151 Socket, TDP MAX 65W
    CPU Support List:
    65W: i7-8700(6c) / i5-8500(6c) / i3-8100(4c)(with ECC)
    35W: i7-8700T(6c) / i5-8500T(6c) / i3-8100T(4c) (with ECC)
    35W: i7-9700TE(8c) / i5-9500TE(6c) / i3-9100TE(4c) (with ECC)
  • PCH C246

Main Memory

  • Dual channel DDR4 SO-DIMM memory Socket with non-ECC support, up to 32 GB 2666MHZ, ECC support as option with Intel® i3-8100, i3-8100T, i3-9100TE


  • AMI (UEFI)


  • Integrated Intel® Gen9 Graphics graphic engine
  • 1 x VGA connector (resolution up to 1920x1080@60Hz)
  • 1 x LVDS connector(resolution up to 1920x1080@60Hz)
  • DDI 1/2 Port configurable to HDMI1.4/DVI/Display port
    1.4 HDMI up to 4096 x 2160@30Hz/24bpp, DVI up to 1920 x1200@60Hz, DP up to 4096 x 2304 @ 60Hz)

COM Express Connector

  • AB :LVDS:(LVDS/eDP co-lay), VGA:(VGA/DDI port3 co-lay), 1 x GbE LAN, 6x PCIe x1, HD Audio, 4 x SATA III, 8 x USB2.0, LPC Bus, SM Bus/I2C, 2 x COM, GPIO 8bit
  • CD : DDI1, DDI2, 1 x PCIe x16, 2 x PCIe x1, 4 x USB3.0

Power Requirement

  • +12VDC, +5Vsb
  • Support both AT and ATX power supply mode


  • 125mm x 95mm


  • Board level operation temperature : -0°C to 60°C
  • Storage temperature : -20˚C to 85˚C
  • Relative humidity:
    10% to 95% (operating, non-condensing)
    5% to 95% (non-operating, non-condensing)


  • Meet CE / FCC Class B

Ordering Information


ICES675S (P/N:10K00067508X0 )
COM Express Type 6, Basic Module, 8/9th Generation Intel® Core™ LGA1151 Processor,C246 PCH with 6 core support, Support dual channel DDR4 with ECC and non-ECC SO-DIMM 2666MHZ up to 32 GB, Support 1 PCIE x16 / 8 PCIE x 1 / 4 x USB3.1 / 8 x USB2.0 / 4 SATA 3.0 and GBE, LVDS(eDP Optional) / VGA (DDI3 Optional)/ DDI 1 / DDI 2

Optional Accessories

CPU Cooler (P/N:5050200161X00)

TPM 2.0 Module KIT (P/N:79E00TPM01X00)


User Manual
Upload Date File Name Version OS Description Download
2020/10/13 ICES675S User Manual 1.0 All OS User Manual 3.7 MB
Upload Date File Name Version OS Description Download
2020/03/05 ICES675 / ICES675S Chipset 1.0 All OS ICES675 / ICES675S Chipset 4.6 MB
2020/03/05 ICES675 / ICES675S Graphics 1.0 All OS ICES675 / ICES675S Graphics 245.9 MB
2020/03/05 ICES675 / ICES675S ME 1.0 All OS ICES675 / ICES675S ME 102.1 MB
2020/03/05 ICES675 / ICES675S Ethernet 1.0 All OS ICES675 / ICES675S Ethernet 69 MB
2020/03/05 ICES675 / ICES675S Audio 1.0 All OS ICES675 / ICES675S Audio 110.1 MB