Overview

The RCB400 T10-05 is a high-performance, modular, and highly integrated control board designed for next-generation intelligent robotics, motion control, and AI-driven automation. Accelerated by the NVIDIA®  Jetson T5000 system-on-module (SOM), it is ideally suited for high-computing-demand applications such as humanoid robots, quadruped robots, autonomous mobile robots (AMRs), smart manufacturing, and intelligent sensing systems. With built-in AI and motion control capabilities, the platform significantly shortens development cycles and accelerates time-to-market for innovative robotic solutions.

At its core, the RCB400 T10-05 integrates the Jetson T5000 SOM, featuring a 2560-core NVIDIA Blackwell architecture GPU, 96 fifth-generation Tensor Cores, and 10 Tensor Processing Clusters (TPCs) supporting Multi-Instance GPU (MIG) technology. This configuration delivers up to 2070 TFLOPS (FP4 – Sparse) of AI inference performance, making it well-suited for compute-intensive and multi-task edge AI applications.

To support a broad range of deployment scenarios, the RCB400-T05-10 offers rich and flexible I/O options, including: 2 x CAN FD for real-time communication and motion control networking, 4 x COM Ports supporting RS-232/422/485 serial interfaces, 4 x 25 GbE ports for sensor, camera, and high-speed networking, 4 x USB 3.2 ports for high-speed data transfer and peripheral integration, 8 x GMSL (Gigabit Multimedia Serial Link) ports for high-resolution cameras and synchronized sensor input

In addition, the RCB400 T05-10 features an MCIO connector and dedicated cable to interface with external I/O boards, enabling modular I/O expansion and flexible adaptation to a variety of system architectures—including industrial automation systems, mobile robotic platforms, and complex robotic frameworks.

Main Features

  • NVIDIA®  Jetson T5000™
  • 14-core Arm®  Neoverse® -V3AE 64-bit CPU 1 MB L2 cache per core 16 MB shared system L3 cache
  • Single Display : HDMI
  • 4 x USB 3.2 Gen2 Type A
  • 2 x CAN FD
  • 2 x RSS232/422/485, 2 x RS232
  • 4 x RJ45 port
  • 8 x GMSL
  • 3 x M.2 Slot
  • 1 x MICO Connector for Expansion I/O Board
  • 16 x GPIO(8IN, 8 Out)
  • DC 24V to 48V input.
  • Support 0~60 °C operating temperature

Specifications

CPU Support

  • 14-core Arm®  Neoverse® -V3AE 64-bit CPU
  • 1 MB L2 cache per core 16 MB shared system L3 cache

GPU Support

  • 2560-core NVIDIA Blackwell architecture GPU, 96 fifth-generation Tensor Cores, and 10 Tensor Processing Clusters (TPCs)

Memory

  • 128 GB 256-bit LPDDR5X 273 GB/s
Rear I/O
  • 1 x HDMI
  • 4 × RJ45 LAN
  • 4 x USB 3.2 Gen2

Internal I/O

  • 1 x 120pin Samtec connector for GMSL Module
  • 4 × COM port (2 x RS232/422/485, 2 x RS232)
  • 2 x CAN FD
  • 1 x MIC-in , 1 x Line-out
  • 16 GPIO(8IN, 8OUT)
  • 1 x MICO connector for Expansion I/O board
Expansion Slot
  • 1 × M.2 Key B 3042/3052 (PCIe x 1, USB3.0)
    - Support 4G/5G module
  • 1 × M.2 Key E 2230 (PCIe x 1 Gen1,  USB2.0)
    - Support WiFi/BT module
Power Requirement
  • DC 24V to 48V input
Dimensions(TBD)
  • 120(W) x 135(H) mm
Environment
  • Operating temperature: Ambient with air flow: 0°C to 60°C (according to IEC60068-2-1, IEC60068-2-2, IEC60068-2-14).
  • Storage temperature: -20°C to 85°C.
  • Relative humidity: 25~50°C, 90% (non-condensing)
Certifications
  • CE
    -EN61000-6-2, EN61000-6-4
  • FCC Class A